Using Deep Learning for segmentation of localized defects on SiC wafers
📋 Type
MA thesis
⚡ Status
finished
📅 Duration
Dec 17, 2018 – Jun 16, 2019
👤
Primary supervisors
Mathis Hoffmann
Andreas Maier
Dr.-Ing. Thomas Wagner (Intego GmbH)
Simone Gaffling M.Sc. (Intego GmbH)